SiC Process Engineer - Power Module in Automotive semiconductor industry (m/f/d)

Vor-Ort Beim Kunden in München

MünchenFlexible Arbeitszeiten30 Urlaubstage

Company Profile: 

Our customer is R&D Center in Munich, which belongs to a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide safer, more comfortable, and more convenient products and services.

 

Duties and responsibilities:

  • Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.;

  • Contribute to developing advanced power module processes, output process files;

  • Support product development team to transfer advanced packaging processes to HQ;

  • Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.

 

Requirements:

Education/Experience

  • Bachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields;
  • 1-3 years of experience in power semiconductor packaging product development or technology R&D is a must;
  • Hand-on experience in industry-leading product development or small scale trial production is preferred;
  • Have proven experience in SiC module development is advantageous;
  • Working experience in a clean room environment;

Knowledge

  • Familiar with the overall situation of semiconductor packaging industry, process steps and machine suppliers is of advantage;
  • Basic knowledge of packaging processes & at least one of the key equipment, e.g. Pick and Place, Sintering Press, Reflow oven, Wire Bonder, Ultrasonic Welding, Molding equipment, etc..

Skills and Competencies

  • Proactive, with pioneering spirit and a good sense of internal and external client;
  • Passionate about engineering, with a strong spirit of innovation;
  • Good command of English written and oral communication skills, Chinese is a plus;
  • Excellent team coordination and communication skills.

 

Our customer offers a competitive salary package and excellent career development opportunities in the promising new energy vehicle industry. If you are interested in this position, please feel free to send your resume to our talent manager Ms. Lan email Kontakt-Formular . We look forward to getting to know you better.

Semiconductor, Automotive, R&D, Process Expert, Power Module, SiC, power semiconductor packaging, Englisch, Elektrotechnik, Maschinenbau
Dieser Job bzw. Stellenanzeige als 'SiC Process Engineer - Power Module in Automotive semiconductor industry (m/f/d)' ist für folgende Adressen ausgeschrieben: 81673 München.
Kurzprofil der DMTG GmbH
Wir sind ein Personal-Service-Plattform und auf der Suche nach hochqualifizierten Fachkräfte, insbesondere aus den Bereichen Automotive/Selbstfahrendes Auto, Finanz- und IT.

Gesuchte Kompetenzen

Vertrieb

Frau Lili Lan
Talent Manager
Weiterführende Links
Wir sind ein Personal-Service-Plattform und auf der Suche nach hochqualifizierten Fachkräfte, insbesondere aus den Bereichen Automotive/Selbstfahrendes Auto, Finanz- und IT.

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