or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; 1-3 years of experience in power semiconductor packaging product development or technology R&D is a must; Hand-on ... Bonder, Ultrasonic Welding, Molding equipment, etc.. Skills and Competencies Proactive, with pioneering spirit and a good sense of internal and external client; Passionate about engineering, with a strong spirit of innovation; Good command

degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; More than 8 years of experience in power semiconductor packaging product development or technology research and ... Proactive, with pioneering spirit and a good sense of internal and external client; Passionate about engineering, with a strong spirit of innovation; Good command of English written and oral communication skills，Chinese is a plus;   Our

strategy, and finally complete the batch production introduction and verification of new chips.   Requirements: Education/Experience Master degree or above in microelectronics, power electronics, electrical engineering, mechanical ... modules; Cooperate with team to complete the pre-research of advanced packaging solutions (Electrical design aspect), and organize electrical  technical cooperation with universities and research institutes; Responsible for SiC power